Technical Data
Product Name
Applications
Features
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ST-1001A
Applied in wafer-level packaging, fan-in packaging
ST-1001A is a high-temperature curing negative-tone photosensitive polyimide product with a curing temperature of 350-400℃, featuring high heat resistance, excellent operational process stability, adhesion, and chemical corrosion resistance.
ST-1012
Applied in buffer coat layers
ST-1012 is a high-temperature curing negative-tone photosensitive polyimide product with a curing temperature of 350-400℃, featuring high voltage resistance, high heat resistance, excellent flexibility, a wide process window, and chemical corrosion resistance.
ST-2001
Applied inwafer-level packaging, fan-out packaging, 2.5D/3D packaging
ST-2001 is a low-temperature curing negative-tone photosensitive polyimide product with a curing temperature of 200-350℃, featuring low stress, excellent operational process stability, adhesion, and chemical corrosion resistance.
ST-2001LV
應(yīng)用于板級封裝
ST-2001LV is a low-viscosity, low-temperature curing negative-tone photosensitive polyimide product with a curing temperature of 200-350℃, featuring low stress, excellent operational process stability, adhesion, and chemical corrosion resistance.
ST-2002
Applied in 2.5D/3D packaging
ST-2002 is an ultra-low-temperature curing negative-tone photosensitive polyimide product with a curing temperature of 180-250℃, featuring low stress, excellent operational process stability, adhesion, and chemical corrosion resistance.